GB/T 40564-2021 Active
GB/T 40564-2021 Test method of epoxy molding compound for electronic packaging
Abstract
This document specifies the test methods for the appearance, gelation time, screw flow length, flying edges, thermal hardness, density, thermal conductivity, viscosity, glass transition temperature, linear thermal expansion coefficient, water absorption, flame retardancy, electrical conductivity, pH value, sodium ion content, chloride ion content, bromide ion content, bromine content, antimony content, chlorine content, ash content, uranium content, flexural strength, impact strength, molding shrinkage rate, bonding strength, volume resistivity, dielectric constant, dielectric loss, and breakdown strength of epoxy encapsulants used in electronic packaging of semiconductor discrete devices, integrated circuits, and special devices.
This document is applicable to the performance testing of epoxy encapsulants used in electronic packaging of semiconductor discrete devices, integrated circuits, and special devices.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 40564-2021 |
| CCS | Electronic devices and specialized materials, parts, and structural components |
| ICS | Special materials for electronic technology |
| Implement Date | 2022-05-01 |