T/CSTM 00989-2023 Active
T/CSTM 00989-2023 The testing methods for microwave parameters under high temperature, low temperature, temperature cycling, and humidity loading conditions
Abstract
Scope: This document specifies the test methods for the microwave parameters of printed circuit boards and copper clad laminates under high temperature, low temperature, temperature cycling, and humidity loading, including general requirements, environmental test methods, insertion loss, characteristic impedance, dielectric constant, and dielectric loss tangent, as well as passive intermodulation testing. This document is applicable to the testing of microwave parameters of printed circuit boards and copper clad laminates under environmental loading. The temperature test range is -65 ℃ to 125 ℃, and the humidity test range is 50% RH to 95% RH. The temperature cycling rate is ≤15 ℃/min.
General Product Information
| Document Type | Group standards |
|---|---|
| Standard Status | Active |
| Standard Code | T/CSTM 00989-2023 |
| CCS | Electronic components and information technology |
| ICS | Printed circuits and printed circuit boards |
| Implement Date | 2023-07-21 |