T/CSTM 00989-2023
Active
Group standards
T/CSTM 00989-2023 The testing methods for microwave parameters under high temperature, low temperature, temperature cycling, and humidity loading conditions
T/CSTM 00989-2023 The testing methods for microwave parameters under high temperature, low temperature, temperature cycling, and humidity loading conditions
Price:
$ 20.00
Basic Information
Standard Code:
T/CSTM 00989-2023
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic components and information technology
ICS Name:
Printed circuits and printed circuit boards
Publish Date:
2023-04-21
Implement Date:
2023-07-21
Pages:
18 pages
Scope
Scope: This document specifies the test methods for the microwave parameters of printed circuit boards and copper clad laminates under high temperature, low temperature, temperature cycling, and humidity loading, including general requirements, environmental test methods, insertion loss, characteristic impedance, dielectric constant, and dielectric loss tangent, as well as passive intermodulation testing. This document is applicable to the testing of microwave parameters of printed circuit boards and copper clad laminates under environmental loading. The temperature test range is -65 ℃ to 125 ℃, and the humidity test range is 50% RH to 95% RH. The temperature cycling rate is ≤15 ℃/min.
Development Information
Related Standards
GB/T 5489-1985
Replaced
GB/T 12559-1990
Active
GB/T 12559-1990 The patternes series for artwork master of printed circuits
GB/T 12629-1990
Replaced
GB/T 12629-1990 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T 12630-1990
Active
GB/T 12630-1990 Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards
GB/T 12631-1990
Replaced
GB/T 12631-1990 Test method for resistance of conductor of printed boards
GB/T 13555-1992
Replaced