T/CSTM 00991-2023 Active
T/CSTM 00991-2023 Test methods for coating/plating used in high-speed printed boards
Abstract
Scope: This document specifies the test methods for coatings/plating layers used on high-speed printed circuit boards, including thickness, roughness, solderability, characteristic impedance, and insertion loss. This document is applicable to coatings/plating layers used on high-speed printed circuit boards, mainly including: organic solderable protective layers (hereinafter referred to as OSP), tin plating, silver plating, chemical nickel gold, chemical nickel palladium gold, and electroplated nickel gold. Surface coatings/plating layers used in other industries can be used for reference. Main technical content: This document specifies the test methods for coatings/plating layers used on high-speed printed circuit boards, including thickness, roughness, solderability, characteristic impedance, and insertion loss. This document is applicable to coatings/plating layers used on high-speed printed circuit boards, mainly including: organic solderable protective layers (hereinafter referred to as OSP), tin plating, silver plating, chemical nickel gold, chemical nickel palladium gold, and electroplated nickel gold. Surface coatings/plating layers used in other industries can be used for reference.
General Product Information
| Document Type | Group standards |
|---|---|
| Standard Status | Active |
| Standard Code | T/CSTM 00991-2023 |
| CCS | Electronic components and information technology |
| ICS | Printed circuits and printed circuit boards |
| Implement Date | 2023-07-07 |