T/CSTM 00991-2023 Active Group standards

T/CSTM 00991-2023 Test methods for coating/plating used in high-speed printed boards

Publish Date: 2023-04-07 Implement Date: 2023-07-07 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CSTM 00991-2023

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Electronic components and information technology

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2023-04-07

Implement Date: 2023-07-07

Pages: 13 pages

Scope

Scope: This document specifies the test methods for coatings/plating layers used on high-speed printed circuit boards, including thickness, roughness, solderability, characteristic impedance, and insertion loss. This document is applicable to coatings/plating layers used on high-speed printed circuit boards, mainly including: organic solderable protective layers (hereinafter referred to as OSP), tin plating, silver plating, chemical nickel gold, chemical nickel palladium gold, and electroplated nickel gold. Surface coatings/plating layers used in other industries can be used for reference. Main technical content: This document specifies the test methods for coatings/plating layers used on high-speed printed circuit boards, including thickness, roughness, solderability, characteristic impedance, and insertion loss. This document is applicable to coatings/plating layers used on high-speed printed circuit boards, mainly including: organic solderable protective layers (hereinafter referred to as OSP), tin plating, silver plating, chemical nickel gold, chemical nickel palladium gold, and electroplated nickel gold. Surface coatings/plating layers used in other industries can be used for reference.