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GB/T 29508-2013 Active
GB/T 29508-2013 300 mm monocrystalline silicon as cut slices and grinded slices
Abstract
This standard specifies the terms and definitions, technical requirements, test methods, inspection rules, and marking, packaging, transportation, and storage for silicon single-crystal cutting and grinding slices (referred to as silicon wafers) with a diameter of 300 mm, a P-type orientation, a <100> crystal orientation, and a resistivity of 0.5Ω·cm to 20Ω·cm.
This standard applies to circular silicon wafers prepared by cutting and grinding 300 mm directly pulled single crystals. The products will be further processed into polished wafers, which are used to make substrate wafers meeting the line width requirements of 90nm for integrated circuits (ICs).
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 29508-2013 |
| CCS | Element semiconductor materials |
| ICS | Semiconductor materials |
| Implement Date | 2014-02-01 |
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