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GB/T 31475-2015 Active
GB/T 31475-2015 Requirements for solder paste for high-quality interconnections in electronics assembly
Abstract
This standard specifies the classification, technical requirements, test methods, inspection rules, and product marking, packaging, transportation, and storage of solder paste for high-quality internal interconnections in electronic assembly (referred to as solder paste).
This standard applies to solder paste used for soft soldering during the interconnection of surface-mount components and electronic circuits.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 31475-2015 |
| CCS | \nTest methods for the physical properties of metals |
| ICS | Semiconductor materials |
| Implement Date | 2016-01-01 |
Price
$ 66
Subtotal
$ 66
Tax
$ 0.00
Order Total (incl. tax)
$ 66