GB/T 31475-2015 Active National standards

GB/T 31475-2015 Requirements for solder paste for high-quality interconnections in electronics assembly

GB/T 31475-2015 Requirements for solder paste for high-quality interconnections in electronics assembly

Publish Date: 2015-05-15 Implement Date: 2016-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 31475-2015
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: \nTest methods for the physical properties of metals
ICS Name: Semiconductor materials
Publish Date: 2015-05-15
Implement Date: 2016-01-01
Pages: 17 pages

Scope

This standard specifies the classification, technical requirements, test methods, inspection rules, and product marking, packaging, transportation, and storage of solder paste for high-quality internal interconnections in electronic assembly (referred to as solder paste).
This standard applies to solder paste used for soft soldering during the interconnection of surface-mount components and electronic circuits.

Development Information

Word Count: 32 Thousand words Pages: 17 pages

Referenced Standards

GB/T 2040-2002 Sheet of copper and copper alloy GB/T 2040-2008 Sheet of copper and copper alloy GB/T 2040-2017 Copper and copper alloy sheet GB/T 2828.1-2003 Sampling procedures for inspection by attributes—Part 1:Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection GB/T 2828.1-2012 Sampling procedures for inspection by attributes—Part 1:Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection GB/T 10574.1-2003 Methods for chemical analysis of tin-lead solders—Determination of tin content GB/T 10574.2-2003 Methods for chemical analysis of Tin-lead solders—Determination of antimony content GB/T 10574.3-2003 Methods for chemical analysis of tin-lead solder—Determination of bismuth content GB/T 10574.4-2003 Methods for chemical analysis of tin-lead solders—Determination of iron content GB/T 10574.5-2003 Methods for chemical analysis of tin-lead solders—Determination of arsenic content GB/T 10574.6-2003 Methods for chemical analysis of tin-lead solders—Determination of copper content GB/T 10574.7-2003 Methods for chemical analysis of tin-lead solders—Determination of silver content GB/T 10574.7-2017 Methods for chemical analysis of tin-lead solders—Part 7:Determination of silver content—Flame atomic absorption spectrometry and potassium thiocyanate potentiometric titra GB/T 10574.8-2003 Methods for chemical analysis of tin-lead solders—Determination of zinc content GB/T 10574.8-2017 Methods for chemical analysis of tin-lead solders—Part 8:Determination of zinc content—Flame atomic absorption spectrometric method GB/T 10574.9-2003 Methods for chemical analysis of tin-lead solders—Determination of aluminum content GB/T 10574.9-2017 Methods for chemical analysis of tin-lead solders—Part 9:Determination of aluminium content—Graphite furnace atomic absorption spectrometric method GB/T 10574.10-2003 Methods for chemical analysis of tin-lead solders—Determination of cadmium content GB/T 10574.10-2017 Methods for chemical analysis of tin-lead solders—Part 10:Determination of cadmium content—Flame atomic absorption spectrometry and Na2EDTA titration method GB/T 10574.11-2003 Methods for chemical analysis of tin-lead solders—Determination of phosphorus content GB/T 10574.11-2017 Methods for chemical analysis of tin-lead solders—Part 11:Determination of phosphorus content—Crystal violet phosphorus-vanadium-molybdeum heteropoly acid spectrophotometry GB/T 10574.12-2003 Methods for chemical analysis of tin-lead solders—Determination of sulphur content GB/T 10574.12-2017 Methods for chemical analysis of tin-lead solders—Part 12:Determination of sulfur content—High frequency combustion with infrared absorption method GB/T 10574.13-2003 Methods for chemical analysis of tin-lead solders—Determination of copper, iron cadmium, silver, gold, arsenic, zinc, aluminium, bismuth, phosphorous content GB/T 10574.13-2017 Methods for chemical analysis of tin-lead solders—Part 13:Determination of antimony,bismuth,iron,arsenic,copper,silver,zinc,aluminium,cadmium,phosphorous and gold contents—Inductively coupled plasma atomic emission spectrometric method GB/T 10574.14-2017 Methods for chemical analysis of tin-lead solders—Part 14:Determination of tin,lead,antimony,bismuth,silver,copper,zinc,cadmium and arsenic content—Optical emission spectrometry GB/T 31476-2015 Requirements for solders for high-quality interconnections in electronics assembly GB/T 31474-2015 Soldering fluxes for high-quality interconnections in electronics assembly YS/T 746.1-2010 Methods for chemical analysis of lead-free tin-based solders—Part 1:Determination of tin content—Pyrogallic acid demasking-lead nitrate titrimetric method YS/T 746.2-2010 Methods for chemical analysis of tin-based lead-free solders—Part 2:Determination of silver content—Flame atomic absorption spectrometric method and potassium thiosulfate titrimetric method YS/T 746.3-2010 Methods for chemical analysis of tin-based lead-free solders—Part 3:Determination of copper content—Flame atomic absorption spectrometric method and sodium thiosulfate titrimetric method YS/T 746.4-2010 Methods for chemical analysis of lead-free tin-based solders—Part 4:Determination of lead content—Flame atomic absorption spectrometric method YS/T 746.5-2010 Methods for chemical analysis of lead-free tin-based solders—Part 5 Determination of bismuth content—Flame atomic absorption spectrometric method and EDTA titrimetric method YS/T 746.6-2010 Methods for chemical analysis of lead-free tin-based solders—Part 6:Determination of antimony content—Flame atomic absorption spectrometric method YS/T 746.7-2010 Methods for chemical analysis of lead-free tin-based solders—Part 7:Determination of iron content—Flame atomic absorption spectrometric method YS/T 746.8-2010 Methods for chemical analysis of lead-free tin-based slders—Part 8:Determination of arsenic content—Molybdenum antimony arsenate blue spectrometric method YS/T 746.9-2010 Methods for chemical analysis of lead-free tin-based solders—Part 9:Determination of zinc content—Flame atomic absorption spectrometric method and Na2EDTA titrimetric method YS/T 746.10-2010 Methods for chemical analysis of lead-free tin-based solders—Part 10:Determination of aluminum content—Electrothermal atomic absorption spectrometric method YS/T 746.11-2010 Methods for chemical analysis of lead-free tin-based solders—Part 11:Determination of Cadmium content—Flame atomic absorption spectrometric method YS/T 746.12-2010 Methods for chemical analysis of lead-free tin-based solders—Part 12:Determination of Indium content—Na2EDTA titrimetric method YS/T 746.13-2010 Methods for chemical analysis of tin-based lead-free solders—Part 13:Determination of nickel content—Flame atomic absorption spectrometric method YS/T 746.14-2010 Methods for chemical analysis of lead-free tin-based solders—Part14:Determination of phosphorus content—Crystal violet phosphorus-vanadium-molybdenum heteropoly acid spectrophotometry YS/T 746.15-2010 Methods for chemical analysis of lead-free tin-based solders—Part 15:Determination of Germanium content—Salicylfluorone-sim polyethylene glycol phenyl ether spectrophotometry YS/T 746.16-2010 Methods for chemical analysis of lead-free tin-based solders—Part 16:Determination of total rare earth content—Arserazo Ⅲ spectrophotometry YS/T 746.17-2018 Method for Chemical Analysis of Lead-free Sn-based solder - Part 17: Determination of Ag, Cu, Pb, Bi, Sb, Fe, As, Zn, Al, Cd, Ni, and In - Electro-magnetic induction coupled plasma atomic emission spectroscopy

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