T/ZZB 3424-2023 Active
T/ZZB 3424-2023 Low Volatile Organic Silicone Electronic Thermal Potting Adhesive
Abstract
Main technical content: This document specifies the terms and definitions, basic requirements, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage, and quality commitments of low-volatility organic silicon electronic thermal conductive encapsulation adhesives (hereinafter referred to as "organic silicon encapsulation adhesives"). This document is applicable to addition-curing two-component organic silicon encapsulation adhesives made by mixing vinyl silicone oil as the base adhesive with silica powder, additives, and other auxiliary materials. It is used for encapsulation protection of electronic components and other electronic products.
General Product Information
| Document Type | Group standards |
|---|---|
| Standard Status | Active |
| Standard Code | T/ZZB 3424-2023 |
| CCS | Adhesive |
| ICS | Adhesives and adhesive products |
| Implement Date | 2023-11-25 |