GB/T 7124-1986
Replaced
T/ZZB 3424-2023
Active
Group standards
T/ZZB 3424-2023 Low Volatile Organic Silicone Electronic Thermal Potting Adhesive
T/ZZB 3424-2023 Low Volatile Organic Silicone Electronic Thermal Potting Adhesive
Price:
$ 20.00
Basic Information
Standard Code:
T/ZZB 3424-2023
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Adhesive
ICS Name:
Adhesives and adhesive products
Publish Date:
2023-11-15
Implement Date:
2023-11-25
Pages:
11 pages
Scope
Main technical content: This document specifies the terms and definitions, basic requirements, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage, and quality commitments of low-volatility organic silicon electronic thermal conductive encapsulation adhesives (hereinafter referred to as "organic silicon encapsulation adhesives"). This document is applicable to addition-curing two-component organic silicon encapsulation adhesives made by mixing vinyl silicone oil as the base adhesive with silica powder, additives, and other auxiliary materials. It is used for encapsulation protection of electronic components and other electronic products.
Development Information
Related Standards
GB/T 7749-1987
Active
GB/T 7749-1987 Test method of cleavage strength of adhesive (metal to metal)
GB/T 7750-1987
Active
GB/T 7750-1987 Test method of creep properties of adhesive in shear by tension loading (metal to metal)
GB/T 11177-1989
Active
GB/T 11177-1989 Testing method for compressive shear strength of dowel joint by inorganic adhesives
GB/T 12216-1990
Abolished
GB/T 12216-1990 The residue from distillation of synthetic fatty acids as binder for foundry
GB/T 13353-1992
Active