GB/T 45713.4-2025 Active
GB/T 45713.4-2025 Electronics assembly technology—Part 4:Endurance test methods for solder joint of area array type package surface mount devices
Abstract
This document specifies the durability test method for the solder joints of array-type packaging devices mounted on printed circuit boards, in order to evaluate the durability of the solder joints against thermal and mechanical stress.
This document is applicable to the evaluation and testing of the durability of solder joints of array-type packaging devices (FBGA, BGA, FLGA, and LGA) and pinless packaging devices (SON, QFN) mounted on printed circuit boards in industrial and consumer electronic and electrical equipment, but it is not applicable to the evaluation and testing of the performance of semiconductor devices themselves.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 45713.4-2025 |
| CCS | Printed circuit board |
| ICS | Printed circuits and printed circuit boards |
| Implement Date | 2025-09-01 |