GB/T 45713.4-2025 Active National standards

GB/T 45713.4-2025 Electronics assembly technology—Part 4:Endurance test methods for solder joint of area array type package surface mount devices

Publish Date: 2025-05-30 Implement Date: 2025-09-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: GB/T 45713.4-2025

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Printed circuit board

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2025-05-30

Implement Date: 2025-09-01

Pages: 40 pages

Scope

This document specifies the durability test method for the solder joints of array-type packaging devices mounted on printed circuit boards, in order to evaluate the durability of the solder joints against thermal and mechanical stress.
This document is applicable to the evaluation and testing of the durability of solder joints of array-type packaging devices (FBGA, BGA, FLGA, and LGA) and pinless packaging devices (SON, QFN) mounted on printed circuit boards in industrial and consumer electronic and electrical equipment, but it is not applicable to the evaluation and testing of the performance of semiconductor devices themselves.

Development Information

Word Count: 57 Thousand words Pages: 40 pages

Referenced Standards

GB/T 2423.22-2002 Environmental testing for electric and electronic products—Part 2:Test methods Test N:Change of temperature GB/T 2423.22-2012 Environmental testing—Part 2:Test methods—Test N:Change of temperature IEC 60191-6-2 IEC 60191-6-5 IEC 61190-1-3 IEC 61249-2-7 IEC 61249-2-8 IEC 62137-3:2011