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GB/T 8750-2022 Active
GB/T 8750-2022 Gold-based bonding wire and bandlet for semiconductor package
Abstract
This document specifies the classification and marking of gold-based bonding wires and tapes used in semiconductor packaging, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, and the contents of accompanying documents and purchase orders (or contracts). This document applies to gold-based bonding wires and tapes used in the packaging of semiconductor discrete devices and integrated circuits.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 8750-2022 |
| CCS | Precious metals and their alloys |
| ICS | Other non-ferrous metal products |
| Implement Date | 2023-07-01 |
Price
$ 113
Subtotal
$ 113
Tax
$ 0.00
Order Total (incl. tax)
$ 113