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GB/T 46717-2025 Active
GB/T 46717-2025 Semiconductor devices—Metallization stress void test
Abstract
This document describes the stress testing method and related criteria for metallized voids in aluminum (Al) or copper (Cu).
This document is applicable to the reliability research and evaluation of semiconductor processes.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 46717-2025 |
| CCS | Semiconductor discrete devices |
| ICS | Integrated Components of Semiconductor Devices |
| Implement Date | 2026-05-01 |
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