GB/T 14264-1993
Replaced
GB/T 46717-2025
Active
National standards
GB/T 46717-2025 Semiconductor devices—Metallization stress void test
GB/T 46717-2025 Semiconductor devices—Metallization stress void test
Price:
$ 44.00
Basic Information
Standard Code:
GB/T 46717-2025
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Semiconductor discrete devices
ICS Name:
Integrated Components of Semiconductor Devices
Publish Date:
2025-10-31
Implement Date:
2026-05-01
Pages:
20 pages
Scope
This document describes the stress testing method and related criteria for metallized voids in aluminum (Al) or copper (Cu).
This document is applicable to the reliability research and evaluation of semiconductor processes.
Development Information
Adopt standards
IEC 62418:2010
Related Standards
GB/T 14844-1993
Replaced
GB/T 14844-1993 Designations of semiconductor materials
GB/T 17573-1998
Active
GB/T 17573-1998 Semiconductor devices Discrete devices and integrated circuits Part 1:General
GB/T 12560-1999
Active
GB/T 12560-1999 Semiconductor devices Sectional specification for discrete devices
GB/T 11499-2001
Active
GB/T 11499-2001 Letter symbols for discrete semiconductor devices
GB/T 20521-2006
Active