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GB/Z 41275.4-2023 Active
GB/Z 41275.4-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array(BGA) re-balling
Abstract
This document specifies the requirements for replacing solder balls on ball grid array (BGA) components in the context of the electronic component management plan (ECMP) for aerospace, defense, and high-reliability products.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/Z 41275.4-2023 |
| CCS | Electronic components |
| ICS | Comprehensive materials for aerospace manufacturing |
| Implement Date | 2024-07-01 |
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$ 122
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$ 122
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Order Total (incl. tax)
$ 122