GB/T 41215-2021
Active
GB/Z 41275.4-2023
Active
National standards
GB/Z 41275.4-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array(BGA) re-balling
GB/Z 41275.4-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array(BGA) re-balling
Basic Information
Standard Code:
GB/Z 41275.4-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic components
ICS Name:
Comprehensive materials for aerospace manufacturing
Publish Date:
2023-12-28
Implement Date:
2024-07-01
Publisher:
国家市场监督管理总局、国家标准化管理委员会
Technical Committee:
全国航空电子过程管理标准化技术委员会(SAC/TC 427)
Pages:
38 pages
Scope
本文件规定了在航空航天、国防和高可靠性产品的电子元器件管理计划（ECMP）的背景下，更换球栅阵列（BGA）元器件封装上焊球的要求。
Development Information
Drafting Units:
中国航空工业集团公司洛阳电光设备研究所、中国航空工业集团公司雷华电子技术研究所、中国航空综合技术研究所、国营芜湖机械厂、太原航空仪表有限公司、中航通飞华南飞机工业有限公司、西北工业大学、苏州锐杰微科技集团有限公司
Drafting Persons:
韦双、邓明春、任海涛、高海峰、吴晓鸣、刘刚、胡晨、杜文杰、刘站平、王宏刚、任烨、张娟、吕冰、周勇军、李九峰、张健云、孙科、喻波、刘航宇、李巍、黄领才、李斌、曲直、方家恩
Same series standard
GB/Z 41275.22-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 22:Technical guidelines
GB/Z 41275.23-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 23:Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
Referenced Standards
IEC 61340-5-1
IEC/TR 61340-5-2
IEC 62090
IEC 62668(所有部分)
AEC-Q100-010
ANSI/ESD S20.20
ECA/IPC/JEDEC J-STD-075
IPC J-STD-001
IPC J-STD-001xS
IPC J-STD-004
IPC J-STD-005
IPC/JEDEC J-STD-020
IPC/JEDEC J-STD-033
JEDEC J-STD-046
JEDEC JESD625
JEDEC JESD22-B107
SAE AS5553
Adopt standards
IEC TS 62647-4:2018
Related Standards
GB/T 41275.21-2022
Active
GB/T 41275.21-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 21:Guidelines for transition to lead-free electronics
GB/T 41275.2-2022
Active
GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2:Mitigation of deleterious effects of tin
GB/T 41275.3-2022
Active
GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3:Performance testing for systems containing lead-free solder and finishes
GB/T 41886-2022
Active
GB/T 41886-2022 Requirements for cabin acoustic design of transport aircraft
GB/T 42846-2023
Active