YS/T 604-2006 Abolished Industry standards-Non-ferrous metals

YS/T 604-2006 Gold based thick film conductor pastes

YS/T 604-2006 Gold based thick film conductor pastes

Publish Date: 2006-05-25 Implement Date: 2006-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: YS/T 604-2006

Standard Type: Industry standards

Standard Status: Abolished

is_force_gb: no

CCS Name: Precious metals and their alloys

ICS Name: Other non-ferrous metals and their alloys

Publish Date: 2006-05-25

Implement Date: 2006-12-01

Pages: 12 pages

Scope

This standard specifies the requirements, test methods, inspection rules, and marking, packaging, transportation, storage, and order form content for gold-based thick-film conductive pastes for thick-film hybrid integrated circuits, sensors, and other devices (hereinafter referred to as gold pastes). This standard applies to gold-based thick-film conductive pastes used in thick-film hybrid integrated circuits, sensors, and other devices (hereinafter referred to as gold pastes).

Development Information

Word Count: 14 Thousand words Pages: 12 pages

Referenced Standards

GB/T 17473.1-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of solids content GB/T 17473.1-2008 Test methods of precious metals pastes used for microelectronics—Determination of solids content GB/T 17473.2-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of fineness GB/T 17473.2-2008 Test methods of precious metals pastes used for microelectronics—Determination of fineness GB/T 17473.3-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of sheet resistance GB/T 17473.3-2008 Test methods of precious metals pastes used for microelectronics—Determination of sheet resistance GB/T 17473.4-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of adhesion GB/T 17473.4-2008 Test methods of precious metals pastes used for microelectronics—Determination of adhesion GB/T 17473.5-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of viscosity GB/T 17473.5-2008 Test methods of precious metals pastes used for microelectronics—Determination of viscosity GB/T 17473.7-1998 Test methods of precious metal pastes used for thick film microelectronics—Test of solderability and solderleaching resistance GB/T 17473.7-2008 Test methods of precious metals pastes used for microelectronics—Determination of solderability and solderelaching resistance GB/T 17473.7-2022 Test methods of precious metals pastes used for microelectronics—Part 7:Determination of solderability and solder leaching resistance

Related Standards

GB/T 13840-1992 Abolished

GB/T 13840-1992 Wafer carriers

Publish Date: 1992-12-28

GB/T 15677-1995 Replaced

GB/T 15677-1995 Lanthanum metal

Publish Date: 1995-08-11

GB/T 3136-1995 abolished_transferred

GB/T 3136-1995 Tantalum powders

Publish Date: 1995-10-17

GB/T 3463-1995 Abolished

GB/T 3463-1995 Tantalum wires

Publish Date: 1995-10-17

GB/T 3628-1995 Replaced

GB/T 3628-1995 Tantalum and tantalum alloy foils

Publish Date: 1995-10-17

GB/T 16476-1996 Replaced

GB/T 16476-1996 Scandium metal

Publish Date: 1996-07-09