DZ/T 0101.12-1994
Active
SJ 21453-2018
Active
Industry standards-Electronics
SJ 21453-2018 Integrated circuit ceramic package-Technical requirements for gold wire bonding process
SJ 21453-2018 Integrated circuit ceramic package-Technical requirements for gold wire bonding process
Price:
$ 30
Basic Information
Standard Code:
SJ 21453-2018
Standard Type:
Industry standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
-
Publish Date:
2018-01-18
Implement Date:
2018-05-01
Pages:
19 pages
Scope
This standard specifies the general requirements for the gold wire bonding process of military integrated circuits in ceramic packages (hereinafter referred to as the gold wire bonding process), as well as detailed requirements for raw materials, equipment, process flow, key control points, and inspections. This standard applies to the gold wire bonding process of the bonding area between the circuit chips and ceramic shells of military integrated circuits in ceramic packages.
Development Information
Referenced Standards
GB/T 25915.1-2010 Cleanrooms and associated controlled environments—Part 1:Classification of air cleanliness
GJB 3007
GJB 548B-2005
SJ 21448-2018 Integrated circuit ceramic package-Inspection requirements for pre-bonding
SJ 21454-2018 Integrated circuit ceramic package-Technical requirements for aluminum-silicon wire bonding process
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