GB/T 4937.11-2018 Active National standards

GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method

GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method

Publish Date: 2018-09-17 Implement Date: 2019-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 4937.11-2018
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Semiconductor discrete devices
ICS Name: Integrated Components of Semiconductor Devices
Publish Date: 2018-09-17
Implement Date: 2019-01-01
Pages: 6 pages

Scope

This part of GB/T 4937 specifies the test method for rapid temperature change - double liquid tank method. When device qualification can be carried out using either air-air temperature cycling or rapid temperature change - double liquid tank method, air-air temperature cycling test shall be preferred. This test can also be used to simulate the impact of cleaning device's heating liquid on the device by conducting a small number of cycles (5 to 10 times). This test is applicable to all semiconductor devices. Unless otherwise specified in relevant specifications, this test is considered destructive. This test is basically consistent with GB/T 2423.22-2002, but in view of the special requirements of semiconductor devices, the provisions of this part are adopted.

Development Information

Word Count: 12 Thousand words Pages: 6 pages

Same series standard

GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12:Vibration,variable frequency GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity) GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17:Neutron irradiation GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18:Ionizing radiation(total dose) GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20:Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21:Solderability GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30:Preconditioning of non-hermetic surface mount devices prior to reliability testing GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1:Handling,packing,labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Referenced Standards

Adopt standards

IEC 60749-11:2002

Related Standards

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