GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3:Performance testing for systems containing lead-free solder and finishes

Scope

This document specifies the test methods, test procedures, and explanatory matters for the performance of systems containing lead-free solder and lead-free pins.
This document is applicable to products in aerospace and defense electronic systems that are transitioning to lead-free solder, and other high-performance, high-reliability electronic industries can refer to it for use.
Note: Products transitioning to lead-free solder include:
——Products that have passed the design and qualification of traditional lead-tin electronic components, materials, and assembly processes, but are undergoing re-qualification using lead-free components;
——Products that have been designed with tin-lead and are being converted to lead-free solder;
——Products that have been newly designed with lead-free solder;
——Assembled and welded-level products, i.e., printed circuit board assembly-level products.

Development Information

Same series standard

Referenced Standards

Adopt standards

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