GB/T 42895-2023 Active National standards

GB/T 42895-2023 Micro-electromechanical systems(MEMS)technology—Bending strength test method for microstructures of silicon based MEMS

GB/T 42895-2023 Micro-electromechanical systems(MEMS)technology—Bending strength test method for microstructures of silicon based MEMS

Publish Date: 2023-08-06 Implement Date: 2023-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 42895-2023
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Micro-components
ICS Name: Integrated circuits, microelectronics
Publish Date: 2023-08-06
Implement Date: 2023-12-01
Pages: 11 pages

Scope

This document describes the requirements and testing methods for in-situ bending strength tests of microstructures involved in silicon-based MEMS processing. This document is applicable to bending strength tests of microstructures manufactured using microelectronics processes.

Development Information

Word Count: 15 Thousand words Pages: 11 pages

Referenced Standards

Related Standards

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