GB/T 43894.1-2024 Active National standards

GB/T 43894.1-2024 Practice for determining semiconductor wafer near-edge geometry—Part 1:Measured height data array using a curvature metric(ZDD)

GB/T 43894.1-2024 Practice for determining semiconductor wafer near-edge geometry—Part 1:Measured height data array using a curvature metric(ZDD)

Publish Date: 2024-04-25 Implement Date: 2024-11-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 43894.1-2024

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: \nTest methods for the physical properties of metals

ICS Name: \nMetal material testing

Publish Date: 2024-04-25

Implement Date: 2024-11-01

Pages: 12 pages

Scope

This document describes a series of methods for evaluating the near-edge geometry of semiconductor wafers using the high-radial second-order derivative (ZDD) method. This document is suitable for silicon polished wafers, silicon epitaxial wafers, SOI wafers, and other circular wafers with surface layers, as well as for evaluating the near-edge geometry of circular wafers made from other semiconductor materials.

Development Information

Word Count: 15 Thousand words Pages: 12 pages

Referenced Standards

GB/T 25915.1-2021 Cleanrooms and associated controlled environments—Part 1:Classification of air cleanliness by particle concentration GB/T 14264-1993 Semiconductor materials—Terms and definitions GB/T 14264-2009 Semiconductor materials—Terms and definitions GB/T 14264-2024 Terminology of semiconductor materials GB/T 16596-1996 Specification for establishing a wafer coordinate system GB/T 16596-2019 Specification for establishing a wafer coordinate system GB/T 34479-2017 Specification for alphanumeric marking of silicon wafers

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