T/ZSA 224-2024 Semiconductor equipment front-end module
T/ZSA 224-2024 Semiconductor equipment front-end module
Basic Information
Scope
Scope: This document specifies the structure and classification of front-end modules for semiconductor equipment, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage. This document applies to front-end modules for semiconductor equipment used with 100 mm, 125 mm, 150 mm, 200 mm, and 300 mm wafers. Front-end modules for semiconductor equipment used with wafers of other specifications may be implemented with reference to this document. Main technical content: This document specifies the structure and classification of front-end modules for semiconductor equipment, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage. This document applies to front-end modules for semiconductor equipment used with 100 mm, 125 mm, 150 mm, 200 mm, and 300 mm wafers. Front-end modules for semiconductor equipment used with wafers of other specifications may be implemented with reference to this document.