DZ/T 0101.12-1994
Active
SJ/Z 21354-2018
Active
Industry standards-Electronics
SJ/Z 21354-2018 Design guidelines for assemblability of SiP products
SJ/Z 21354-2018 Design guidelines for assemblability of SiP products
Price:
$ 30
Basic Information
Standard Code:
SJ/Z 21354-2018
Standard Type:
Industry standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
-
Publish Date:
2018-01-18
Implement Date:
2018-05-01
Pages:
10 pages
Scope
This guidance technical document specifies the assembly-friendly principles that should be followed in the design of system-level packaging (SiP) products, including general requirements, component and material specifications, structural design requirements, process specifications, and reliability requirements related to the manufacturing process. This guidance technical document is applicable to the assembly-friendly design of SiP products.
Development Information
Referenced Standards
GB/T 12842-1991 Terminology for film integrated circuits and hybrid film integrated circuits
GB/T 14113-1993 Terminology of packages for semiconductor integrated circuits
GB/T 9178-1988 Terminology for integrated circuits
GJB 3243
GJB 3404
GJB 4907
GJB 548B-2005
SJ/Z 21355-2018 Design guidelines for hermetic package of SiP products
SJ/Z 21356-2018 Design guidelines for flip chip bonding process of SiP products
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