GB/T 18033-2000
Replaced
YS/T 819-2012
Active
Industry standards-Non-ferrous metals
YS/T 819-2012 High-purity sputtering copper target used in electronic film
YS/T 819-2012 High-purity sputtering copper target used in electronic film
Basic Information
Standard Code:
YS/T 819-2012
Standard Type:
Industry standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Heavy metals and their alloys
ICS Name:
Copper products
Publish Date:
2012-11-07
Implement Date:
2013-03-01
Pages:
8 pages
Scope
This standard specifies the requirements, test methods, inspection rules, and marking, packaging, transportation, storage, quality certificates, and contract (or order form) content for high-purity copper sputtering targets used in electronic films.
This standard applies to all types of high-purity copper sputtering targets used in the manufacture of electronic films (hereinafter referred to as high-purity copper targets).
Development Information
Referenced Standards
GJB 1580A
GB/T 14265-1993 General rule of chemical analysis for hydrogen, oxygen, nitrogen, carbon and sulfur in metal's materials
GB/T 14265-2017 General rule of chemical analysis for hydrogen,oxygen, nitrogen, carbon and sulfur in metallic materials
YS/T 347-2004 Copper and copper alloys—Estimation of average grain size
YS/T 837-2012 Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies
YS/T 347-2020 The method for measuring the average grain size of copper and copper alloys
Related Standards
GB/T 8000-2001
Replaced
GB/T 8000-2001 Brass tube in heat-exchanger—Ammonial test for residual stress corrosion
GB/T 11087-2001
Replaced
GB/T 11087-2001 Brass strip for heat-exchanger tubing
GB/T 5231-2001
Replaced
GB/T 5231-2001 Wrought copper and copper alloys chemical composition limits and forms of wrought products
GB/T 18813-2002
Replaced
GB/T 18813-2002 Transformer copper strip
GB/T 2040-2002
Replaced