GB/T 4298-1984
Abolished
GB/T 44842-2024
Active
National standards
GB/T 44842-2024 Micro-electromechanical systems(MEMS) technology—Bend testing methods of thin film materials
GB/T 44842-2024 Micro-electromechanical systems(MEMS) technology—Bend testing methods of thin film materials
Price:
$ 54
Basic Information
Standard Code:
GB/T 44842-2024
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Micro-components
ICS Name:
Other discrete semiconductor devices
Publish Date:
2024-10-26
Implement Date:
2024-10-26
Pages:
16 pages
Scope
This document describes the bending test method for thin film materials with a length and width of less than 1 mm and a thickness of 0.1 μm to 10 μm. Thin films are used as the main structural materials in micro-electromechanical systems (MEMS) and micromachines.
As the main structural materials in devices such as MEMS and micromachines, thin films have unique characteristics, such as being a few micrometers in size, being prepared using deposition and photolithography processes, and/or having non-machined test structures. This document describes the bending test method for micro-scale smooth cantilever test structures and the shape of the test structures, in order to ensure test accuracy that corresponds to the unique characteristics of the thin film materials.
Development Information
Referenced Standards
IEC 62047-6:2009
Adopt standards
IEC 62047-18:2013
Related Standards
GB/T 15449-1995
Active
GB/T 15449-1995 Blank detail-specification for field-effect transistors for case-rated swatching application
GB/T 15450-1995
Abolished
GB/T 15450-1995 Blank detail specification for silicon dual-gate field-effect transistors
GB/T 15529-1995
Active
GB/T 15529-1995 Blank detail specification for LED numeric displays
GB/T 32817-2016
Active
GB/T 32817-2016 Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS
GB/T 41852-2022
Active