YS/T 603-2006 Abolished Industry standards-Non-ferrous metals

YS/T 603-2006 Sintering silver conductive paste

YS/T 603-2006 Sintering silver conductive paste

Publish Date: 2006-05-25 Implement Date: 2006-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: YS/T 603-2006

Standard Type: Industry standards

Standard Status: Abolished

is_force_gb: no

CCS Name: Precious metals and their alloys

ICS Name: Other non-ferrous metals and their alloys

Publish Date: 2006-05-25

Implement Date: 2006-12-01

Pages: 12 pages

Scope

This standard specifies the requirements, test methods, inspection rules, and marking, packaging, transportation, storage, and order form content for sintered silver conductor pastes.
This standard applies to thick-film hybrid integrated circuits, piezoelectric ceramic filters and resonators, disc ceramic capacitors, vacuum fluorescent displays, defrosting electrodes, and circuit leads for discrete components that use silver paste (hereinafter referred to as silver paste).

Development Information

Word Count: 15 Thousand words Pages: 12 pages

Referenced Standards

GB/T 2424.17-1995 Environmental testing for electric and electronic products—Guidance on soldering test GB/T 2424.17-2008 Environmental testing for electric and electronic products—Part 2:Tests methods Guidance on test T:Soldering test GB/T 17473.1-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of solids content GB/T 17473.1-2008 Test methods of precious metals pastes used for microelectronics—Determination of solids content GB/T 17473.2-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of fineness GB/T 17473.2-2008 Test methods of precious metals pastes used for microelectronics—Determination of fineness GB/T 17473.3-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of sheet resistance GB/T 17473.3-2008 Test methods of precious metals pastes used for microelectronics—Determination of sheet resistance GB/T 17473.4-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of adhesion GB/T 17473.4-2008 Test methods of precious metals pastes used for microelectronics—Determination of adhesion GB/T 17473.5-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of viscosity GB/T 17473.5-2008 Test methods of precious metals pastes used for microelectronics—Determination of viscosity GB/T 17473.7-1998 Test methods of precious metal pastes used for thick film microelectronics—Test of solderability and solderleaching resistance GB/T 17473.7-2008 Test methods of precious metals pastes used for microelectronics—Determination of solderability and solderelaching resistance GB/T 17473.7-2022 Test methods of precious metals pastes used for microelectronics—Part 7:Determination of solderability and solder leaching resistance

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