GB/T 4855-1984
Abolished
GB/T 44775-2024
Active
National standards
GB/T 44775-2024 Integrated circuit 3D packaging—Requirement for die stack process and evaluation
GB/T 44775-2024 Integrated circuit 3D packaging—Requirement for die stack process and evaluation
Price:
$ 74
Basic Information
Standard Code:
GB/T 44775-2024
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Microcircuit
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2024-10-26
Implement Date:
2025-05-01
Pages:
24 pages
Scope
This document specifies the process and evaluation requirements for chip stacking using wire bonding and flip-chip bonding in three-dimensional packaging of integrated circuits.
This document is applicable to circuits that use wire bonding and flip-chip bonding for stacking in three-dimensional packaging of integrated circuits.
Development Information
Referenced Standards
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished