T/CSTM 00989-2023 Active Group standards

T/CSTM 00989-2023 The testing methods for microwave parameters under high temperature, low temperature, temperature cycling, and humidity loading conditions

T/CSTM 00989-2023 The testing methods for microwave parameters under high temperature, low temperature, temperature cycling, and humidity loading conditions

Publish Date: 2023-04-21 Implement Date: 2023-07-21 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/CSTM 00989-2023
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: Electronic components and information technology
ICS Name: Printed circuits and printed circuit boards
Publish Date: 2023-04-21
Implement Date: 2023-07-21
Pages: 18 pages

Scope

Scope: This document specifies the test methods for the microwave parameters of printed circuit boards and copper clad laminates under high temperature, low temperature, temperature cycling, and humidity loading, including general requirements, environmental test methods, insertion loss, characteristic impedance, dielectric constant, and dielectric loss tangent, as well as passive intermodulation testing. This document is applicable to the testing of microwave parameters of printed circuit boards and copper clad laminates under environmental loading. The temperature test range is -65 ℃ to 125 ℃, and the humidity test range is 50% RH to 95% RH. The temperature cycling rate is ≤15 ℃/min.

Development Information

Pages: 18 pages

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