GB/T 24341-2009
Active
T/XAI 17-2023
Active
Group standards
T/XAI 17-2023 The design specifications for solder pad used in electrical testing of the epitaxial film baseplate
T/XAI 17-2023 The design specifications for solder pad used in electrical testing of the epitaxial film baseplate
Price:
$ 30
Basic Information
Standard Code:
T/XAI 17-2023
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic components
ICS Name:
Electrical and electronic engineering drawing
Publish Date:
2023-08-01
Implement Date:
2023-08-01
Scope
Scope: This document specifies the requirements for the size, number, alignment marks, and style of pads used for electrical testing of flip-chip film substrates, and provides a verification method. This document is applicable to the design of pads for electrical testing of flip-chip film substrates. Main technical content: 1. Scope 2. Normative reference documents 3. Terms and definitions 4. Requirements 5. Verification method