GB/T 11093-1989
Replaced
T/CNIA 0174-2022
Active
Group standards
T/CNIA 0174-2022 Recovering silicon from silicon wafer cutting waste materials
T/CNIA 0174-2022 Recovering silicon from silicon wafer cutting waste materials
Price:
$ 20.00
Basic Information
Standard Code:
T/CNIA 0174-2022
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Semiconductor materials
Publish Date:
2022-12-21
Implement Date:
2023-06-01
Scope
Main technical content: This document specifies the technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, accompanying documents, and order form content for the recycled silicon produced from silicon polycrystalline ingots and silicon monocrystalline ingots cutting waste. This document is applicable to recycled silicon products produced from silicon polycrystalline ingots and silicon monocrystalline ingots cutting waste, which are mainly used for alloy preparation, organic silicon production, and the preparation of silicon carbide ceramics, etc.
Development Information
Related Standards
GB/T 13388-1992
Replaced
GB/T 13388-1992 Method for measuring crystallographic orientation of flats on single crystal silicon slices and wafers by X-ray techniques
GB/T 13389-1992
Replaced
GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon
GB/T 13843-1992
Abolished
GB/T 13843-1992 Polished monocrystalline sapphire substrates
GB/T 14015-1992
Active
GB/T 14015-1992 Silicon on sapphire epitaxial wafers
GB/T 14139-1993
Replaced