GB/T 11093-1989
Replaced
T/ZZB 2675-2022
Active
Group standards
T/ZZB 2675-2022 TVS used silicon single crystal polishing sheet
T/ZZB 2675-2022 TVS used silicon single crystal polishing sheet
Price:
$ 20.00
Basic Information
Standard Code:
T/ZZB 2675-2022
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Element semiconductor materials
ICS Name:
Semiconductor materials
Publish Date:
2022-04-13
Implement Date:
2022-05-13
Pages:
11 pages
Scope
Main technical content: This document specifies the terms and definitions, product classification, basic requirements, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage, and the content of purchase orders (or contracts) and quality commitments for silicon single-crystal wafers (hereinafter referred to as silicon wafers) used in transient voltage suppression diodes (TVS). This document is applicable to silicon single-crystal wafers with diameters of 100 mm, 125 mm, and 150 mm, which are prepared by the direct-pulling method using electronic-grade polysilicon as the main raw material.
Development Information
Related Standards
GB/T 13388-1992
Replaced
GB/T 13388-1992 Method for measuring crystallographic orientation of flats on single crystal silicon slices and wafers by X-ray techniques
GB/T 13389-1992
Replaced
GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon
GB/T 13843-1992
Abolished
GB/T 13843-1992 Polished monocrystalline sapphire substrates
GB/T 14015-1992
Active
GB/T 14015-1992 Silicon on sapphire epitaxial wafers
GB/T 14139-1993
Replaced