GB/T 32280-2022 Active National standards

GB/T 32280-2022 Test method for warp and bow of silicon wafers—Automated non-contact scanning method

Publish Date: 2022-03-09 Implement Date: 2022-10-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 32280-2022

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: \nTest methods for the physical properties of metals

ICS Name: \nMetal material testing

Publish Date: 2022-03-09

Implement Date: 2022-10-01

Publisher: 国家市场监督管理总局、国家标准化管理委员会

Technical Committee: 全国半导体设备和材料标准化技术委员会(SAC/TC 203)、全国半导体设备和材料标准化技术委员会材料分技术委员会(SAC/TC 203/SC 2)

Pages: 14 pages

Scope

本文件描述了利用两个探头在硅片表面自动非接触扫描测试硅片的翘曲度和弯曲度的方法。
本文件适用于直径不小于50 mm，厚度不小于100 μm的洁净、干燥的硅片，包括切割、研磨、腐蚀、抛光、外延、刻蚀或其他表面状态的硅片，也可用于砷化镓、碳化硅、蓝宝石等其他半导体晶片翘曲度和弯曲度的测试。

Development Information

Drafting Units:

有研半导体硅材料股份公司、山东有研半导体材料有限公司、合肥中南光电有限公司、浙江金瑞泓科技股份有限公司、洛阳鸿泰半导体有限公司、浙江海纳半导体有限公司、上海合晶硅材料股份有限公司、开化县检验检测研究院、天津中环领先材料技术有限公司、义乌力迈新材料有限公司、有色金属技术经济研究院有限责任公司

Drafting Persons:

孙燕、蔡丽艳、贺东江、李素青、王可胜、徐新华、张海英、王振国、潘金平、曹雁、楼春兰、张雪囡、皮坤林

Word Count: 28 Thousand words Pages: 14 pages

Replace the following standards

GB/T 32280-2015 Test method for warp of silicon wafers—Automated non-contact scanning method

Referenced Standards

GB/T 6619-1995 Test methods for bow of silicon slices GB/T 6619-2009 Test methods for bow of silicon wafers GB/T 6620-1995 Test method for measuring warp on silicon slices by noncontact scanning GB/T 6620-2009 Test method for measuring warp on silicon slices by noncontact scanning GB/T 14264-1993 Semiconductor materials—Terms and definitions GB/T 14264-2009 Semiconductor materials—Terms and definitions GB/T 14264-2024 Terminology of semiconductor materials GB/T 16596-1996 Specification for establishing a wafer coordinate system GB/T 16596-2019 Specification for establishing a wafer coordinate system

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