GB/T 8646-1998 abolished_transferred National standards

GB/T 8646-1998 Fine aluminum-1% silicon wire for semiconductor lend-bonding

Publish Date: 1998-07-15 Implement Date: 1999-02-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 8646-1998

Standard Type: National standards

Standard Status: abolished_transferred

is_force_gb: no

CCS Name: Semi-metal

ICS Name: Semiconductor materials

Publish Date: 1998-07-15

Implement Date: 1999-02-01

Pages: 8 pages

Development Information

Word Count: 9 Thousand words Pages: 8 pages

Replace the following standards

GB 8646-1988

Superseded by the following standards

YS/T 543-2006 Fine aluminum-1% silicon wire for semiconductor lend-bonding

Referenced Standards

GB/T 191-90 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB 6987.1~6987.21-86 GB/T 8750-1997 Gold wire for semiconductor devices lead bonding GB/T 10573-89 GB/T 15077-94 SJ/T 10705-96