GB/T 4937.31-2023 Active National standards

GB/T 4937.31-2023 Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices(internally induced)

GB/T 4937.31-2023 Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices(internally induced)

Publish Date: 2023-05-23 Implement Date: 2023-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 4937.31-2023
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Semiconductor discrete devices
ICS Name: Integrated Components of Semiconductor Devices
Publish Date: 2023-05-23
Implement Date: 2023-12-01
Publisher: 国家市场监督管理总局、国家标准化管理委员会
Technical Committee: 全国半导体器件标准化技术委员会(SAC/TC 78)
Pages: 6 pages

Scope

本文件适用于半导体器件(分立器件和集成电路),以下简称器件。
本文件用于确定器件是否由于过负荷引起内部发热而燃烧。

Development Information

Drafting Units:

中国电子科技集团公司第十三研究所、河北北芯半导体科技有限公司、安徽钜芯半导体科技有限公司、河北中电科航检测技术服务有限公司、北京赛迪君信电子产品检测实验室有限公司、绵阳迈可微检测技术有限公司、山东省中智科标准化研究院有限公司、佛山市川东磁电股份有限公司

Drafting Persons:

裴选、彭浩、张魁、曹孙根、席善斌、魏兵、赵鹏、徐昕、米村艳、李明钢、颜天宝

Word Count: 8 Thousand words Pages: 6 pages

Same series standard

Adopt standards

IEC 60749-31:2002

Related Standards

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