GB/T 4937.42-2023 Active National standards

GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage

GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage

Publish Date: 2023-05-23 Implement Date: 2023-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 4937.42-2023
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Semiconductor discrete devices
ICS Name: Integrated Components of Semiconductor Devices
Publish Date: 2023-05-23
Implement Date: 2023-12-01
Publisher: 国家市场监督管理总局、国家标准化管理委员会
Technical Committee: 全国半导体器件标准化技术委员会(SAC/TC 78)
Pages: 9 pages

Scope

本文件描述了评价半导体器件耐高温高湿环境能力的试验方法。
本文件适用于评价塑封半导体器件和其他类型封装半导体器件的芯片金属化互连耐腐蚀能力。也可作为由于湿气通过钝化层渗透而导致漏电的加速方法,以及多种试验前的预处理方法。

Development Information

Drafting Units:

中国电子科技集团公司第十三研究所、武汉中原电子集团有限公司、安徽俊承科技有限公司、武汉格物芯科技有限公司、河北北芯半导体科技有限公司、深圳基本半导体有限公司

Drafting Persons:

裴选、周勇、崔从俊、何黎、尹丽晶、汪之涵、张魁、和巍巍

Word Count: 13 Thousand words Pages: 9 pages

Same series standard

Referenced Standards

IEC 60749-20

Adopt standards

IEC 60749-42:2014

Related Standards

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