YS/T 611-2006 Replaced Industry standards-Non-ferrous metals

YS/T 611-2006 Electrode paste used for PTC ceramic

YS/T 611-2006 Electrode paste used for PTC ceramic

Publish Date: 2006-05-25 Implement Date: 2006-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: YS/T 611-2006

Standard Type: Industry standards

Standard Status: Replaced

is_force_gb: no

CCS Name: Precious metals and their alloys

ICS Name: Other non-ferrous metals and their alloys

Publish Date: 2006-05-25

Implement Date: 2006-12-01

Pages: 8 pages

Scope

This standard specifies the requirements, test methods, inspection rules, and marking, packaging, transportation, storage, and order form content for electrode pastes used in PTC ceramics.
This standard applies to pastes (hereinafter referred to as electrode pastes) used for making ohmic contact electrodes and surface electrodes for PTC thermistors.

Development Information

Word Count: 11 Thousand words Pages: 8 pages

Superseded by the following standards

XB/T 242-2023 lanthanum fluoride cerium oxide YS/T 611-2023 Temperature-compensating ceramic electrode paste

Referenced Standards

GB/T 3131-2001 Tin-lead solder GB/T 3131-2020 Tin-lead solder GB/T 17473.1-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of solids content GB/T 17473.1-2008 Test methods of precious metals pastes used for microelectronics—Determination of solids content GB/T 17473.2-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of fineness GB/T 17473.2-2008 Test methods of precious metals pastes used for microelectronics—Determination of fineness GB/T 17473.3-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of sheet resistance GB/T 17473.3-2008 Test methods of precious metals pastes used for microelectronics—Determination of sheet resistance GB/T 17473.5-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of viscosity GB/T 17473.5-2008 Test methods of precious metals pastes used for microelectronics—Determination of viscosity GB/T 17473.7-1998 Test methods of precious metal pastes used for thick film microelectronics—Test of solderability and solderleaching resistance GB/T 17473.7-2008 Test methods of precious metals pastes used for microelectronics—Determination of solderability and solderelaching resistance GB/T 17473.7-2022 Test methods of precious metals pastes used for microelectronics—Part 7:Determination of solderability and solder leaching resistance

Related Standards

GB/T 13840-1992 Abolished

GB/T 13840-1992 Wafer carriers

Publish Date: 1992-12-28

GB/T 15677-1995 Replaced

GB/T 15677-1995 Lanthanum metal

Publish Date: 1995-08-11

GB/T 3136-1995 abolished_transferred

GB/T 3136-1995 Tantalum powders

Publish Date: 1995-10-17

GB/T 3463-1995 Abolished

GB/T 3463-1995 Tantalum wires

Publish Date: 1995-10-17

GB/T 3628-1995 Replaced

GB/T 3628-1995 Tantalum and tantalum alloy foils

Publish Date: 1995-10-17

GB/T 16476-1996 Replaced

GB/T 16476-1996 Scandium metal

Publish Date: 1996-07-09