YS/T 614-2006 Replaced Industry standards-Non-ferrous metals

YS/T 614-2006 Sliver palladium thick film conductor paste

YS/T 614-2006 Sliver palladium thick film conductor paste

Publish Date: 2006-05-25 Implement Date: 2006-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: YS/T 614-2006

Standard Type: Industry standards

Standard Status: Replaced

is_force_gb: no

CCS Name: Precious metals and their alloys

ICS Name: Other non-ferrous metals and their alloys

Publish Date: 2006-05-25

Implement Date: 2006-12-01

Pages: 6 pages

Scope

This standard specifies the requirements, test methods, inspection rules, marking, packaging, transportation, storage, and order form content for silver-palladium thick-film conductor pastes.
This standard applies to silver-palladium conductor pastes used in thick-film hybrid circuits and discrete devices (hereinafter referred to as silver-palladium pastes).

Development Information

Word Count: 8 Thousand words Pages: 6 pages

Superseded by the following standards

YS/T 614-2020 Silver palladium thick film conductor paste

Referenced Standards

GB/T 17473.1-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of solids content GB/T 17473.1-2008 Test methods of precious metals pastes used for microelectronics—Determination of solids content GB/T 17473.2-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of fineness GB/T 17473.2-2008 Test methods of precious metals pastes used for microelectronics—Determination of fineness GB/T 17473.3-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of sheet resistance GB/T 17473.3-2008 Test methods of precious metals pastes used for microelectronics—Determination of sheet resistance GB/T 17473.4-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of adhesion GB/T 17473.4-2008 Test methods of precious metals pastes used for microelectronics—Determination of adhesion GB/T 17473.5-1998 Test methods of precious metal pastes used for thick film microelectronics—Determination of viscosity GB/T 17473.5-2008 Test methods of precious metals pastes used for microelectronics—Determination of viscosity GB/T 17473.7-1998 Test methods of precious metal pastes used for thick film microelectronics—Test of solderability and solderleaching resistance GB/T 17473.7-2008 Test methods of precious metals pastes used for microelectronics—Determination of solderability and solderelaching resistance GB/T 17473.7-2022 Test methods of precious metals pastes used for microelectronics—Part 7:Determination of solderability and solder leaching resistance

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