GB/T 4298-1984
Abolished
GB/T 43493.1-2023
Active
National standards
GB/T 43493.1-2023 Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 1:Classification of defects
GB/T 43493.1-2023 Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 1:Classification of defects
Basic Information
Standard Code:
GB/T 43493.1-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic devices and specialized materials, parts, and structural components
ICS Name:
Other discrete semiconductor devices
Publish Date:
2023-12-28
Implement Date:
2024-07-01
Pages:
21 pages
Scope
This document provides a classification of defects in 4H-SiC (silicon carbide) homoepitaxial wafers. The defects are classified according to their crystallographic structure and identified using non-destructive testing methods such as optical microscopy (OM), photoluminescence (PL), and X-ray topography (XRT) imaging.
Development Information
Same series standard
GB/T 43493.2-2023 Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 2:Test method for defects using optical inspection
GB/T 43493.3-2023 Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 3:Test method for defects using photoluminescence
Adopt standards
IEC 63068-1:2019
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