GB/Z 41275.23-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 23:Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

Scope

This document provides technical background, procurement guidelines, engineering procedures, and guidelines to assist organizations in reworking/repairing aerospace and high-performance electronic systems, whether they are assembled or have been reworked/repaired using traditional alloys (SnPb or lead-free alloys) or solder and surface coatings. This document includes a review of known impacts and issues, as well as reworking/repair processes, with a focus on providing a technical framework for maintenance technicians to perform their tasks. This document provides guidance on disassembling and replacing components. The term "reworking/repair" in this document is used according to the definitions in Sections 3.1.29 and 3.1.30. The information contained in this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changes in the knowledge base, this document is intended for guidance purposes only.

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