GB/T 41215-2021
Active
GB/Z 41275.23-2023
Active
National standards
GB/Z 41275.23-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 23:Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
GB/Z 41275.23-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 23:Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
Basic Information
Standard Code:
GB/Z 41275.23-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic components
ICS Name:
Comprehensive materials for aerospace manufacturing
Publish Date:
2023-12-28
Implement Date:
2024-07-01
Publisher:
国家市场监督管理总局、国家标准化管理委员会
Technical Committee:
全国航空电子过程管理标准化技术委员会(SAC/TC 427)
Pages:
37 pages
Scope
本文件提供了技术背景、采购指南、工程程序和指南，以帮助组织进行航空航天和高性能电子系统的返工/修复，无论是采用传统合金(SnPb或无铅合金)或焊料与表面镀层结合物已装配的或已返工/修复的系统。本文件包含对已知影响和问题的回顾及返工/修复工艺，重点为维修技术人员执行任务提供技术架构。本文件提供了部件拆卸和更换的指南。本文件中术语“返工/修复”按3.1.29和3.1.30中的定义使用。本文件中包含的信息是基于发布时行业的当前知识。由于知识库的快速变化，本文件仅用于指导。
Development Information
Drafting Units:
国营芜湖机械厂、中国航空综合技术研究所、中国航空工业集团公司雷华电子技术研究所、中国航空工业集团公司洛阳电光设备研究所、中国航空工业集团公司沈阳飞机设计研究所、太原航空仪表有限公司、广州汉源微电子封装材料有限公司
Drafting Persons:
刘鹏、李珊珊、任海涛、唐起源、刘姚军、单奕萌、胡晨、刘刚、张晓蕾、李金猛、吕冰、刘站平、栗晓飞、于淼、杜文杰、宁江天
Same series standard
GB/Z 41275.4-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array(BGA) re-balling
GB/Z 41275.22-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 22:Technical guidelines
Referenced Standards
IEC/TS 62647-1:2012
Adopt standards
IEC/TS 62647-23:2013
Related Standards
GB/T 41275.21-2022
Active
GB/T 41275.21-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 21:Guidelines for transition to lead-free electronics
GB/T 41275.2-2022
Active
GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2:Mitigation of deleterious effects of tin
GB/T 41275.3-2022
Active
GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3:Performance testing for systems containing lead-free solder and finishes
GB/T 41886-2022
Active
GB/T 41886-2022 Requirements for cabin acoustic design of transport aircraft
GB/T 42846-2023
Active