GB/T 46379-2025 Active National standards

GB/T 46379-2025 Bismaleimide triazine (BT) base material for integrated circuit (IC) package

Publish Date: 2025-10-31 Implement Date: 2026-02-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: GB/T 46379-2025

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Electronic devices and specialized materials, parts, and structural components

ICS Name: Special materials for electronic technology

Publish Date: 2025-10-31

Implement Date: 2026-02-01

Pages: 20 pages

Scope

This document specifies the product classification, materials, requirements, quality assurance, packaging and labeling, transportation, and storage of double-sided copper foil encapsulation substrates using bis-maleimide triazine (BT) as the main resin, with an insulation layer thickness of 0.015 mm to 3.2 mm. Other printed circuit copper foil laminates used for encapsulation substrates may be used as reference.

Development Information

Word Count: 24 Thousand words Pages: 20 pages

Referenced Standards

GB/T 2036-1994 Terms for printed circuits GB/T 4721-2021 General rules for rigid copper clad laminates for printed circuits GB/T 4722-2017 Test methods for rigid copper clad laminates for printed circuits board GB/T 5230-1995 Electrodeposited copper foil GB/T 5230-2020 Electrodeposited copper foil for printed board GB/T 18373-2001 E-glass fabric woven for printed boards GB/T 18373-2013 E-glass fabric woven for printed boards GB/T 43801-2024 Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency—Split post dielectric resonator method SJ/T 10668-2023 SJ/T 10668-2023 Electronic Assembly Technology Terminology SJ/T 10668-1995 Terminology for surface mount technology

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