GB/T 11093-1989
Replaced
T/ZPP 016-2022
Active
Group standards
T/ZPP 016-2022 Photovoltaic silicon slice debonding and insertion integration technology requirements
T/ZPP 016-2022 Photovoltaic silicon slice debonding and insertion integration technology requirements
Price:
$ 20.00
Basic Information
Standard Code:
T/ZPP 016-2022
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Semiconductor materials
Publish Date:
2022-08-31
Implement Date:
2022-09-15
Scope
Main technical content: This document specifies the terms and definitions, operation process, equipment, performance parameters, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage requirements for the debonding and inserting of photovoltaic silicon wafers. This document is applicable to the integrated process of debonding and inserting photovoltaic silicon wafers.
Development Information
Related Standards
GB/T 13388-1992
Replaced
GB/T 13388-1992 Method for measuring crystallographic orientation of flats on single crystal silicon slices and wafers by X-ray techniques
GB/T 13389-1992
Replaced
GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon
GB/T 13843-1992
Abolished
GB/T 13843-1992 Polished monocrystalline sapphire substrates
GB/T 14015-1992
Active
GB/T 14015-1992 Silicon on sapphire epitaxial wafers
GB/T 14139-1993
Replaced