DZ/T 0101.12-1994
Active
SJ 21452-2018
Active
Industry standards-Electronics
SJ 21452-2018 Interated circuit ceramic package-Technical requirements for die-attachment process by adhesives
SJ 21452-2018 Interated circuit ceramic package-Technical requirements for die-attachment process by adhesives
Price:
$ 30
Basic Information
Standard Code:
SJ 21452-2018
Standard Type:
Industry standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
-
Publish Date:
2018-01-18
Implement Date:
2018-05-01
Pages:
10 pages
Scope
This standard specifies the general and detailed requirements for the bonding and mounting process of integrated circuit ceramic package chips. This standard is applicable to the process of bonding silicon chips with adhesive materials to ceramic tube shells, and is also applicable to the bonding and mounting process of gallium nitride and gallium arsenide chips
Development Information
Referenced Standards
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