GB/T 31474-2015 Active National standards

GB/T 31474-2015 Soldering fluxes for high-quality interconnections in electronics assembly

GB/T 31474-2015 Soldering fluxes for high-quality interconnections in electronics assembly

Publish Date: 2015-05-15 Implement Date: 2016-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 31474-2015

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: \nTest methods for the physical properties of metals

ICS Name: Semiconductor materials

Publish Date: 2015-05-15

Implement Date: 2016-01-01

Pages: 20 pages

Scope

This standard specifies the classification, technical requirements, test methods, inspection rules, and product marking, packaging, transportation, and storage of fluxes used for high-quality internal interconnections in electronic assembly (referred to as fluxes).
This standard is primarily applicable to fluxes used for soldering contacts in printed circuit board assembly and electrical and electronic circuits.

Development Information

Word Count: 36 Thousand words Pages: 20 pages

Referenced Standards

GB/T 2423.32-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Test Ta:Solderability test by the wetting balance method GB 190-1990 Labels for packages of dangerous goods GB 190-2009 Packing symbol of dangerous goods GB/T 191-2000 Packaging—Pictorial marking for handling of goods GB/T 191-2008 Packaging—Pictorial marking for handling of goods GB/T 2040-2002 Sheet of copper and copper alloy GB/T 2040-2008 Sheet of copper and copper alloy GB/T 2040-2017 Copper and copper alloy sheet GB/T 2423.16-1999 Environmental testing for electric and electronic products—Part 2:Tests methods—Test J and guidance:Mould growth GB/T 2423.16-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Test J and guidance:Mold growth GB/T 2423.16-2022 Environmental testing—Part 2:Test methods—Test J and guidance:Mould growth GB/T 8145-2003 Gum rosin GB/T 8145-2021 Gum rosin GB/T 21652-2008 Copper and copper alloy wire GB/T 21652-2017 Copper and copper alloy wire GB/T 191-2025 Graphical symbols marking for handling and storage of packages

Related Standards

GB/T 11093-1989 Replaced

GB/T 11093-1989 Liquid encapsulated czochralski-grown gallium arsenide single crystals and As-cut slices

Publish Date: 1989-03-31

GB/T 13388-1992 Replaced

GB/T 13388-1992 Method for measuring crystallographic orientation of flats on single crystal silicon slices and wafers by X-ray techniques

Publish Date: 1992-02-19

GB/T 13389-1992 Replaced

GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon

Publish Date: 1992-02-19

GB/T 13843-1992 Abolished

GB/T 13843-1992 Polished monocrystalline sapphire substrates

Publish Date: 1992-12-28

GB/T 14015-1992 Active

GB/T 14015-1992 Silicon on sapphire epitaxial wafers

Publish Date: 1992-12-28

GB/T 14139-1993 Replaced

GB/T 14139-1993 Silicon epitaxial wafers

Publish Date: 1993-02-06