GB/T 31476-2015 Active National standards

GB/T 31476-2015 Requirements for solders for high-quality interconnections in electronics assembly

Publish Date: 2015-05-15 Implement Date: 2016-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 31476-2015

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: \nTest methods for the physical properties of metals

ICS Name: Semiconductor materials

Publish Date: 2015-05-15

Implement Date: 2016-01-01

Pages: 17 pages

Scope

This standard specifies the classification, technical requirements, test methods, inspection rules, and product marking, packaging, transportation, and storage of solder used for high-quality internal interconnection in electronic assembly.
This standard applies to solder used for brazing connections in electronic product assembly, including lead-containing solder, lead-free solder, and special solder.