GB/T 8446.2-2022
Active
T/CEPEA 0102-2023
Active
Group standards
T/CEPEA 0102-2023 Electrostatic chuck for etching process of compound semiconductor devices
T/CEPEA 0102-2023 Electrostatic chuck for etching process of compound semiconductor devices
Price:
$ 31.00
Basic Information
Standard Code:
T/CEPEA 0102-2023
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Integrated Electromechanical Components
Publish Date:
2024-03-01
Implement Date:
2024-03-15
Scope
This document defines the terms and definitions of the electrostatic chuck (hereinafter referred to as the electrostatic chuck) used in the etching process of compound semiconductor devices, and specifies its structure and classification, operating conditions, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage. This document is applicable to electrostatic chucks used in the etching of compound semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN), as well as materials with low electron mobility such as silicon dioxide (SiO2), sapphire, and glass.
Development Information
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