GB/T 11093-1989
Replaced
T/CIET 723-2024
Active
Group standards
T/CIET 723-2024 Semiconductor CMP polishing material technical specification
T/CIET 723-2024 Semiconductor CMP polishing material technical specification
Price:
$ 20.00
Basic Information
Standard Code:
T/CIET 723-2024
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Semiconductor materials
Publish Date:
2024-10-23
Implement Date:
2024-10-23
Scope
Scope: This document specifies the product classification, technical requirements, test methods, inspection rules, and marking, packaging, transportation, and storage of semiconductor CMP polishing materials. This document applies to semiconductor CMP polishing materials. Main technical content: This document specifies the product classification, technical requirements, test methods, inspection rules, and marking, packaging, transportation, and storage of semiconductor CMP polishing materials. This document applies to semiconductor CMP polishing materials.
Development Information
Related Standards
GB/T 13388-1992
Replaced
GB/T 13388-1992 Method for measuring crystallographic orientation of flats on single crystal silicon slices and wafers by X-ray techniques
GB/T 13389-1992
Replaced
GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon
GB/T 13843-1992
Abolished
GB/T 13843-1992 Polished monocrystalline sapphire substrates
GB/T 14015-1992
Active
GB/T 14015-1992 Silicon on sapphire epitaxial wafers
GB/T 14139-1993
Replaced