T/CIET 723-2024 Active Group standards

T/CIET 723-2024 Semiconductor CMP polishing material technical specification

T/CIET 723-2024 Semiconductor CMP polishing material technical specification

Publish Date: 2024-10-23 Implement Date: 2024-10-23 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/CIET 723-2024
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: Semiconductor materials
Publish Date: 2024-10-23
Implement Date: 2024-10-23

Scope

Scope: This document specifies the product classification, technical requirements, test methods, inspection rules, and marking, packaging, transportation, and storage of semiconductor CMP polishing materials. This document applies to semiconductor CMP polishing materials. Main technical content: This document specifies the product classification, technical requirements, test methods, inspection rules, and marking, packaging, transportation, and storage of semiconductor CMP polishing materials. This document applies to semiconductor CMP polishing materials.

Development Information

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