GB/T 11093-1989
Replaced
T/CASMES 125-2022
Active
Group standards
T/CASMES 125-2022 Wafer Thinning and Splitting Technical Specification
T/CASMES 125-2022 Wafer Thinning and Splitting Technical Specification
Price:
$ 20.00
Basic Information
Standard Code:
T/CASMES 125-2022
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Semiconductor materials
Publish Date:
2022-09-30
Implement Date:
2022-10-01
Scope
Main technical content: This document specifies the basic requirements, processes, quality requirements, maintenance, and safety of wafer thinning and scribing technology. This document is applicable to guiding wafer thinning and scribing, and can also be used as a reference by production enterprises when applying thinning and scribing technology during the wafer manufacturing process.
Development Information
Related Standards
GB/T 13388-1992
Replaced
GB/T 13388-1992 Method for measuring crystallographic orientation of flats on single crystal silicon slices and wafers by X-ray techniques
GB/T 13389-1992
Replaced
GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon
GB/T 13843-1992
Abolished
GB/T 13843-1992 Polished monocrystalline sapphire substrates
GB/T 14015-1992
Active
GB/T 14015-1992 Silicon on sapphire epitaxial wafers
GB/T 14139-1993
Replaced