GB/T 11093-1989
Replaced
T/ACCEM 473-2024
Active
Group standards
T/ACCEM 473-2024 DFN packaging process technical specifications
T/ACCEM 473-2024
Price:
$ 20.00
Basic Information
Standard Code:
T/ACCEM 473-2024
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Semiconductor materials
Publish Date:
2024-12-24
Implement Date:
2024-12-31
Scope
Main technical content: This document specifies the process flow and requirements, inspection standards, packaging, labeling, storage, and transportation of the DFN packaging process technology. This document is applicable to the process guidance of DFN packaging product production.
Development Information
Related Standards
GB/T 13388-1992
Replaced
GB/T 13388-1992 Method for measuring crystallographic orientation of flats on single crystal silicon slices and wafers by X-ray techniques
GB/T 13389-1992
Replaced
GB/T 13389-1992 Practice for conversion between resistivity and dopant density for boron-doped and phosphorus-doped silicon
GB/T 13843-1992
Abolished
GB/T 13843-1992 Polished monocrystalline sapphire substrates
GB/T 14015-1992
Active
GB/T 14015-1992 Silicon on sapphire epitaxial wafers
GB/T 14139-1993
Replaced